Patent Amendments ©(Part II of II)

Taiwan IP Updates ĄV May 2025

By Lyndon

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MediaTek Unveils AI Processor for Chromebook Plus

MediaTek, the second most productive patent holder in Taiwan last year, has announced the arrival of their new processor, the Kompanio Ultra, which the company described as the latest step forward in artificial intelligence-powered, high-performance Chromebooks. MediaTek, the largest IC designer in Taiwan, said the new platform leverages the company’s proven expertise in cutting-edge innovations to bring on-device AI capabilities, superior computing performance, and industry-leading power efficiency to the newest Chromebook Plus devices. MediaTek also announced that Chromebooks powered by the Kompanio Ultra processor will hit the market shelves in the coming months in June this year. The Kompanio Ultra platform is MediaTek’s most powerful Chromebook processor to date, and integrates 50 trillion operations per second (50 TOPS) of AI processing power to enable on-device generative AI experiences. On the back of MediaTek’s eighth-generation network processing unit (NPU), Chromebook users can expect real-time task automation, personalized computing, and seamless AI-enhanced workflows with local processing for enhanced speed, security, efficiency, and support for AI workloads without an internet connection. MediaTek said the new platform is built on the sophisticated 3 nanometer process and adopts all-big-core CPU architecture with an Arm Cortex-X925 processor clocked at up to 3.62GHz, which enables the platform to deliver industry-leading single and multithreaded performance in handling intensive applications like video editing, content creation, or high-resolution gaming.

TSMC’s Newest Wafer Tech to Enter Taiwan Mass Production in 2027

TSMC, Taiwan’s invention patent leader, unveiled its next-generation System-on-Wafer-X (SoW-X) technology on May 1st, 2025. TSMC, the world’s largest contract manufacturer, said in a press release that SoW-X will deliver up to 40 times the computing power of current solutions, marking a major leap for system-on-wafer designs. The new design is built on its advanced CXhip-on-Wafer-on-Substrate (CoWoS) platform. The chipmaker added that it plans to bring 9.5 reticle size CoWoS to volume production in 2027. This will enable the integration of 12 or more high-bandwidth memory stacks into a single package, addressing the surging AI demand. TSMC is also developing supporting technologies, such as silicon photonics integration and compact optical engines, to enhance logic performance and energy efficiency. New integrated voltage regulators for AI applications are expected to provide five times the vertical power density of traditional solutions. In addition to logic and packaging advances, TSMC announced the introduction of new radio frequency and automotive technologies. Its N4C RF process will support WiFi 8 and advanced AI features for next-generation wireless devices, with pilot production set for early 2026. TSMC’s N3A process is nearing the final stages of automotive-grade validation while the company continues to refine its N4e process to meet the energy efficiency needs for edge AI applications.

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